Tipster @Greymon55 claimed that AMD s upcoming Ryzen refreshes with 3D V-Cache will enter mass production by November. This is in line with AMD s announcement that 3D V-Cache Ryzen CPUs will hit the market by Q1 2022, likely as a stopgap against Alder Like while Zen 4 is finalized for a Q3 2022 release.
AMD donne plus de détails sur technologie 3D V-Cache
Il y a peu de temps,
AMD a présenté, lors d une conférence de presse durant le dernier
Computex, sa technologie
3D V-Cache, via un
RYZEN 9 5900X V-Cache. Un processeur qui est un 5900X en 12 cores et 24 threads, mais qui intègre de la mémoire cache supplémentaire. En effet, ce modèle propose un 3D Vertical Cache, cest-à-dire que nous avons une puce de cache L3 supplémentaire qui a été superposée au-dessus des Die du processeur. Ainsi, ce RYZEN 9 5900X V-Cache disposait de 64 Mo de mémoire cache L3 additionnelle, en plus des 32 Mo de mémoire cache L3 disponibles normalement dans le processeur. Ainsi ce RYZEN 9 5900X V-Cache dispose de pas moins de 96 Mo de mémoire cache L3.
During AMD's keynote at Computex, we got an early look at new 3D stacking technology that the company is working on. Using a prototype Ryzen 9 5900X with 3D stacking, significant performance improvements were shown, with games running up to 25 percent faster.
AMD demos Ryzen 9 5900X prototype with added 3D V-Cache AMD / TSMC s 3D stacking shown to boost game performance by 15 per cent on average. Read more.
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Re: AMD demos Ryzen 9 5900X prototype with added 3D V-Cache
Both AMD and Intel have talked about the use of such stacking,but the bigger issue is going to be cooling each layer sufficiently. Is the extra cache on top of the existing cache locations on the chiplet?? It would make sense of the copper connection layer to be over the cores??
I might not be serious. Originally Posted by
CAT-THE-FIFTH
Both AMD and Intel have talked about the use of such stacking,but the bigger issue is going to be cooling each layer sufficiently. Is the extra cache on top of the existing cache locations on the chiplet?? It would make sense of the copper connection layer to be over the cores??That s what the picture seems to show - the CCDs remain single layer and covered only by a structural substrate (that should conduct thermall