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PCB-based packaging for GaN power devices and modules is the subject of a UK government-funded consortium that will develop both technology and an all-UK G

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Cambridge ,Cambridgeshire ,United Kingdom ,Geoff Haynes ,Nigel Salter ,Semiconductor Applications ,United Kingdom Research ,Electric Revolution ,Cambridge Gan Devices ,Cambridge Microelectronics ,Compound Semiconductor Applications Catapult ,Pulse Power ,Thinking Pod Innovations ,

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