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By Lisa Wang / Staff reporter, with ReutersTaiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it is more than doubling its US investment to US$40 billion as it plans to make 3-nanometer chips in 2026 at a second Arizona fab, adding to the chipmaker’s original plan of building a US$12 billion fab to make 4-nanometer chips in 2024.

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