ASE has developed an assembly design kit (ADK) that helps customers using ASE’s Fan Out Chip on Substrate (FOCoS) and 2.5D Middle End of Line (MEOL) technologies to make use of the full Siemens HDAP design flow. ASE and Siemens have extended their partnership to include the future creation of a single design platform from FOWLP to 2.5D substrate design. All of these use the Xpedition Substrate Integrator software and Calibre 3DSTACK platform that Siemens acquired from Mentor Graphics.
“By adopting the Siemens Xpedition Substrate Integrator and Calibre 3DSTACK technologies, and through integration with the current ASE design flow, we can now leverage this mutually developed flow to significantly reduce 2.5D/3D IC and FOCoS package assembly planning and verification cycle times by about 30 to 50 percent in each design iteration,” said Dr. C.P. Hung, vice president, ASE Group. “Through the comprehensive design flow, we can now more quickly and easily co-design with our customers for 2.5D/3D IC and FOCoS design and close any physical verification issues for their entire wafer package assembly.”