Intel to build new plant in Malaysia

Intel Corp is to spend US$7.1 billion building a new chip packaging facility in Malaysia, a major Asian investment intended to address an endemic global semiconductor shortage at a time when Washington is advocating domestic production.
The US chipmaker intends to invest 30 billion ringgit (US$7.1 billion) shoring up its advanced chip packaging capabilities in Penang state, Malaysia’s main investment promotion agency said in a statement on Monday.
The company plans to elaborate on its plans for the Asian nation at a news conference tomorrow in conjunction with Malaysian Minister of International Trade and Industry Azmin Ali and Malaysian Investment Development Authority

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