High Density Packaging User Group Announces Nippon Denkai Membership
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High Density Packaging (HDP) User Group is pleased to announce that Nippon Denkai has become our newest member.
CAVE CREEK, Ariz. (PRWEB)
January 21, 2021
“Nippon Denkai is excited to be a member of the HDP User Group. We look forward to learning from our member partners through the collaborative problem solving approach fostered by the HDP team. By contributing our knowledge in copper foils, we believe that our participation will assist in projects related to printed circuit board processing, reliability, and signal integrity,” said Michael Coll, COO at Denkai America.