China readying $143 billion package for its chip firms in face of U.S. curbs--sources | The Asahi Shimbun: Breaking News, Japan News and Analysis

HONG KONG--China is working on a more than 1 trillion yuan ($143 billion) support package for its semiconductor industry, three sources said, in a major step towards self-sufficiency in chips and to counter U.S. moves aimed at slowing its technological advances.

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