The 12th generation Intel Core mobile and desktop processors have recently arrived in the embedded computing space, with implementations on the high-performance Computer-on-Module standards COM-HPC and COM Express. Featuring an innovative performance hybrid architecture, the new high-end embedded processors, formerly codenamed Alder Lake, are more than just another next generation of Intel Core i9, i7, i5, or i3 processors. So, what makes the difference? And what can engineers of next-generation high-end embedded and edge appliances expect from these new modules?