2 months ago
New Lattice MachXO2ZE FPGA Options Deliver High Density I/O Support at Small Size, Low Power to Enable Smart Consumer and Industrial IoT Edge Devices
HILLSBORO, Ore.–(BUSINESS WIRE)–Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced new versions of the Lattice MachXO2ZE™ FPGA family with wafer level chip-scale packaging (WLCSP) and increased I/O density. With package sizes as small as 2.5 x 2.5 mm, standby power levels as low as 22 μW, and up to 63 general-purpose I/Os (GPIO), MachXO2ZE FPGAs are a compelling hardware platform for signal bridging and/or interface applications in smart consumer and industrial IoT devices operating at the network Edge.