Samsung has announced a new type of HBM. Named HBM-PIM, this is the world’s first High Bandwidth Memory integrated with artificial intelligence processing power. Featuring a processing-in-memory design, HBM-PIM is aimed at data centre use, HPC systems, and AI-enabled mobile applications.
Although HBM-PIM has been designed for such tasks, Samsung will work with AI specialists for “even more advanced PIM-powered applications”. Rick Stevens, Argonne’s Associate Laboratory director for computing, environment, and life sciences, stated it’s glad that Samsung is tackling the “memory bandwidth/power challenges for HPC and AI computing” with HBM-PIM, providing noticeable performance improvements in various classes of AI applications.
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Samsung has announced that it has developed some new High Bandwidth Memory with AI Processing Power.
The new HBM or High Bandwidth Memory comes with Ai capabilities built in, it is designed for large scale data centers and high performance computers.
Kwangil Park, senior vice president of Memory Product Planning at Samsung Electronics stated, “Our groundbreaking HBM-PIM is the industry’s first programmable PIM solution tailored for diverse AI-driven workloads such as HPC, training and inference. We plan to build upon this breakthrough by further collaborating with AI solution providers for even more advanced PIM-powered applications.”
Rick Stevens, Argonne’s Associate Laboratory Director for Computing, Environment and Life Sciences commented, “I’m delighted to see that Samsung is addressing the memory bandwidth/power challenges for HPC and AI computing. HBM-PIM design has demonstrated impressive performance and power gains on important classes o
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