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Telit Cinterion Introduces The Latest 5G Embb LGA Modules At MWC Barcelona 2024, Powered By The Snapdragon X72 5G Modem-RF System

Telit Cinterion Introduces The Latest 5G Embb LGA Modules At MWC Barcelona 2024, Powered By The Snapdragon X72 5G Modem-RF System
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Telit-cinterion
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Qualcomm-technologie
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Telit Cinterion Introduces the Latest 5G eMBB LGA Modules at MWC Barcelona 2024, Powered by the Snapdragon X72 5G Modem-RF System

State-of-the-art Telit Cinterion FE990B34/40 LGA module family driven by the latest and greatest 3GPP Release 17 5G chipsetHigh-power quad-core CPU delivers substantial processing power for customer applications

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Telit-cinterion
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Telit Cinterion Introduces the Latest 5G eMBB LGA Modules at MWC Barcelona 2024, Powered by the Snapdragon X72 5G Modem-RF System

Telit Cinterion Introduces the Latest 5G eMBB LGA Modules at MWC Barcelona 2024, Powered by the Snapdragon X72 5G Modem-RF System
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Telit-cinterion
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Qualcomm-technologie
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Gautam-sheoran

Qualcomm, Ericsson, and Airtel Showcase 5G RedCap Device Capabilities

Qualcomm, Ericsson, and Airtel Showcase 5G RedCap Device Capabilities
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Qualcomm-technologie
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Bharti-airtel
Wireless-broadband-communications
Ericsson
Airtel
Qualcomm
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IMC 2023: Qualcomm, Ericsson and Airtel demo 5G RedCap device capabilities

IMC 2023: Qualcomm, Ericsson and Airtel demo 5G RedCap device capabilities
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