TSMC’s (Taiwan Semiconductor) 2.5D advanced packaging CoWoS (Chip on wafer and wafer on substrate) technology is currently the primary technology used for AI
TSM plans to invest ~$2.9B for advanced chip plant in Taiwan amid rise of AI seekingalpha.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from seekingalpha.com Daily Mail and Mail on Sunday newspapers.
TSMC to Build $2.87 Billion Facility For Advanced Chip Packaging anandtech.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from anandtech.com Daily Mail and Mail on Sunday newspapers.
TSMC confirms plans for a yet another massive advanced chip packaging facility in Taiwan and is expected to formally announce its fab in Germany in the coming weeks.
In order to migrate to a technology-driven knowledge economy, there needs to be a complete change of direction. The emphasis must shift to creating top class universities of engineering and.