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TSMC Showcases New Technology Developments at 2023 Technology Symposium

TSMC Showcases New Technology Developments at 2023 Technology Symposium
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TSMC To Begin Mass Production of 2-nanometer Chips By 2025 At Hsinchu Fab, To Get ASML's Advanced High-NA EUV Chipmaking Tool By 2024

TSMC To Begin Mass Production of 2-nanometer Chips By 2025 At Hsinchu Fab, To Get ASML's Advanced High-NA EUV Chipmaking Tool By 2024
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TSMC FinFlex™, N2 Process Innovations Debut at 2022 North America Technology Symposium – Consumer Electronics Net

TSMC FinFlex™, N2 Process Innovations Debut at 2022 North America Technology Symposium – Consumer Electronics Net
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Apple Supplier TSMC announced 3nm chips with Revolutionary 'FinFlex' Architectural Innovation, 2nm Chips starting production in 2025 & more

Late yesterday TSMC showcased the newest innovations in its advanced logic, specialty, and 3D IC technologies at the Company’s 2022 North America Technology Symposium, with the next-generation leading-edge N2 process powered by nanosheet transistors and the unique FINFLEX™ technology for the N3 and N3E processes making their debut.

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