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TSMC details 12.8 Tbps on-package communication solution — an efficient silicon photonics interconnect for AI
TSMC goes optical with a 3D stacked silicon photonics interconnect called COUPE — Compact Universal Photonic Engine. It could deliver up to 12.8 Tbps of on-package connectivity for future chip designs.
United-states
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Kevin-zhang
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Vice-president
Compact-universal-photonic-engine
Octal-small-form-factor-pluggable
Optical-engine
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