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GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers

GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
digitimes.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from digitimes.com Daily Mail and Mail on Sunday newspapers.

United States , Igor Elkanovich , Aditya Raina , Global Unichip Corp , Taiwan Semiconductor Manufacturing Co , D Service Package , Global Unichip , Double Data Rate , Cowos Total , Taiwan Semiconductor Manufacturing ,

GUC Provides 3DIC ASIC Total Service Package to AI, HPC, and Networking Customers

GUC Provides 3DIC ASIC Total Service Package to AI, HPC, and Networking Customers
eetimes.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from eetimes.com Daily Mail and Mail on Sunday newspapers.

United States , Aditya Raina , Igor Elkanovich , Taiwan Semiconductor Manufacturing Co , Global Unichip Corp , Global Unichip , Double Data Rate , Cowos Total , Taiwan Semiconductor Manufacturing ,

GUC taped out UCIe 32G IP using TSMC 3nm and CoWoS technology

GUC taped out UCIe 32G IP using TSMC 3nm and CoWoS technology
digitimes.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from digitimes.com Daily Mail and Mail on Sunday newspapers.

Igor Elkanovich , Aditya Raina , Ucie Consortium , Global Unichip Corp , Global Unichip , Universal Chiplet Interconnect Express , Dynamic Voltage , Frequency Scaling ,

GUC announces 5nm HBM3 PHY and controller silicon proven at 8.4Gbps

GUC announces 5nm HBM3 PHY and controller silicon proven at 8.4Gbps
digitimes.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from digitimes.com Daily Mail and Mail on Sunday newspapers.

United States , Igor Elkanovich , Sean Tai , Global Unichip Corp , America Technology Symposium , Global Unichip , Partner Pavilion , America Technology ,

Global Unichip : Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

May. 16, 2023

News Content:

Cadence 112G-LR SerDes. | May 16, 2023 ....

Glink Cowo , Sanjive Agarwala , Dan Kochpatcharin , Igor Elkanovich , Global Unichip Corp , Ip Group At Cadence , Design Infrastructure Management Division , Companies To Work , Cadence Design Systems Inc , Design Systems , Global Unichip , Intelligent System Design , Intelligent System Design Strategy , Cadence Design Systems , Global Unichip Corp Stock Exchange , Press Release , Adence 3443 Tw0003443008 ,