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AMD Instinct MI300 GPU: 3D die-stacking, HBM3, PCIe 5.0, 600W+ power

AMD s next-gen Instinct MI300: CDNA 3 GPU with 5nm and 6nm + 3D die-stacking + 8 x HBM3 stack memory + PCIe 5.0 + 600W+ of power.

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HBM3 PHY

The Rambus High-Bandwidth Memory generation 3 (HBM3) PHY is optimized for systems that require a high-bandwidth, low-latency memory solution. The memory .

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High Bandwidth Memory: HBM3 is twice as fast as HBM2e, up to 819 GB/s per stack

In numbers, an HBM3 stack can reach 819 GB/s of bandwidth and have 64 GB of capacity. In comparison, the HBM2e stacks used by the AMD MI250.

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HBM3 PHY

The Rambus High-Bandwidth Memory generation 3 (HBM3) PHY is optimized for systems that require a high-bandwidth, low-latency memory solution. The memory .

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SK Hynix HBM3 memory is even faster than expected

While SK Hynix planned to offer at least 665 GB/s of bandwidth with its HBM3 memory, the company has been able to handily surpass that goal. Today, SK Hynix officially announced the specifications for its HBM3 memory, with each module offering 819 GB/s of maximum bandwidth. SK Hynix has become the first company in the …

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