Kaby Lake-G chip back from the grave, now on NAS motherboard theregister.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from theregister.com Daily Mail and Mail on Sunday newspapers.
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Cadence and Intel Foundry have collaborated to develop and certify an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the growing complexity in heterogeneously integrated multi-chip(let) architectures. The collaboration enables Intel customers to leverage advanced packaging to accelerate the high-performance computing (HPC), AI, and mobile computing design space. The advanced…
The Electronics Weekly team share some fingerposts - their picks of the week, in terms of announcements, developments, quotes or anything else in the wide world of electronics that caught their eye.
Feb. 21, 2024 — EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded [.]