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Samsung strikes back in AI chip war with 12-layer HBM3E DRAM

Samsung strikes back in AI chip war with 12-layer HBM3E DRAM
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Samsung strikes back in AI chip war with 12-layer HBM3E DRAM

Samsung Electronics succeeded in developing the industry’s first 36-gigabyte (GB) 12-layer HBM3E DRAM, which boasts the fastest data processing speed among AI memory chips, the company said, Tuesday.

Bae-yong-cheol
Baek-byung-yeul
Samsung
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Samsung-electronics
Courtesy-of-samsung-electronics
Samsung-electronic
High-bandwidth-memory
Hbm
Market
Capacity

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