TSMC’s (Taiwan Semiconductor) 2.5D advanced packaging CoWoS (Chip on wafer and wafer on substrate) technology is currently the primary technology used for AI
TSMC to Build $2.87 Billion Facility For Advanced Chip Packaging anandtech.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from anandtech.com Daily Mail and Mail on Sunday newspapers.
TSMC confirms plans for a yet another massive advanced chip packaging facility in Taiwan and is expected to formally announce its fab in Germany in the coming weeks.
Technological advancements and soaring requirements for chips could drive the semiconductor industry's long-term growth. Given this backdrop, should investors buy, sell, or hold the chip stock Taiwan Semiconductor Manufacturing (TSM)?.