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Unibap to Supply Advanced Data Handling Computer for NASA's HyTI-2 ACMES Mission

Berlin, Germany (SPX) Jan 26, 2024 -
Unibap AB (publ) has announced securing an important order for its SpaceCloud iX10 platform, earmarked for NASA s forthcoming Hyperspectral Thermal Imaging satellite mission, HyTI-2. Valued at $350, ....

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Thermal Management System Market To Surpass USD 85.49 Billion By 2030 | Exclusive Report By Fortune Business Insights™

Thermal Management System Market To Surpass USD 85.49 Billion By 2030 | Exclusive Report By Fortune Business Insights™
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Major Players like 3M, Honeywell, and Laird Technologies Fuel Growth in the Thermal Management Technologies Market: In-Depth Analysis of Market Drivers and Competitive Landscape

/PRNewswire/ The "The Market for Thermal Management Technologies" report has been added to ResearchAndMarkets.com s offering. The global thermal management. ....

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Electronics Industry Drives Demand for Thermal Management

Dublin, Oct. 31, 2023 (GLOBE NEWSWIRE) The ....

Comair Rotron , Netzsch Geratebau Gmb , Aavid Thermalloy , Chomerics Division Of Parker Hannifin , Henkel Ag Co , Amkor Technology , Master Bond Inc , Performance Embedded Computers , Cooler Master Technology Inc , Ametek Inc , Laird Technologies Inc , Data Centers , Dynatron Corp , Management Software , Ansys Inc , Porter Five Forces Analysis , Admat Inc , Motivair Corp , Alcoa Corp , Ai Technology , Cps Technologies Corp , Altair Engineering Inc , Asetek Inc , Materion Corp , Stats Chippac Ltd , Lord Corp ,

"Effect of Interlayer-Compressed Argon Gas Active Cooling on Microstruc" by Jianfei Zhang, Siyu Zhou et al.

Wire arc additive manufacturing (WAAM) has been widely used due to its advantages of low cost and high efficiency. However, one of the unsolved problems in WAAM is the heat accumulation. In this study, the compressed argon-based interlayer active cooling (AC) process is employed to reduce heat accumulation, and the influence mechanism on microstructure and mechanical properties of Ti–6Al–4V samples are revealed. It is shown in the results that the introduction of interlayer AC leads to the interlayer temperature decreases from 468 to 53 °C, and the widths of prior-β grains and αGB are refined. The increase of cooling rate (380–604 °C s−1) results in the transformation of large-sized colonies into finer basket weave structure, accompanied by the production of martensite α’. The finer basket weave structure increases the strength of the samples, while the narrower αGB and the high-angle grain boundaries increase the resistance of crack propagation. The high dislocation de ....

Active Cooling , Tensile Properties , I 6al 4v , Wire Arc Additive Manufacturing ,