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Rumor: AMD Working on ‘Milan-X’ With 3D Die Stacking, Onboard HBM By Joel Hruska on May 25, 2021 at 3:15 pm This site may earn affiliate commissions from the links on this page. Terms of use. Back at its Financial Analyst Day in 2020, AMD showed a diagram emphasizing its server CPU design chops and that chiplets weren’t the last step in the evolution of its CPUs. AMD opted to draw a line from its first deployment of HBM in 2015 through to the launch of chiplets, including a future CPU delivering X3D packaging with a combination of 2.5D and 3D technologies. AMD never announced a specific product that would bring X3D to market, but a new rumor suggests the company is working on a product codenamed “Milan-X.” Milan-X would be based on AMD’s most recent Epyc processor architecture, but it would deploy far more memory bandwidth than we’ve seen in an AMD server before. ....
Operator Greetings, and welcome to the SailPoint Technologies Holdings, Inc. First Quarter 2021 Earnings Conference Call. [Operator Instructions]. It is now my pleasure to introduce your host, Josh Harding, Senior Vice President of Financial Planning, Analysis and Investor Relations. Please go ahead. Josh Harding Senior Vice President of Financial Planning Analysis and Investor Relations Good afternoon, and thank you for joining us today to discuss SailPoint s first quarter 2021 financial results. Joining me today are SailPoint s CEO and Co-Founder, Mark McClain and our Chief Financial Officer, Jason Ream. Please note that today s call will include forward-looking statements, and because these statements are based on the company s current intent, expectations and projections, they are not guarantees of future performance and a variety of factors could cause actual results to differ materially. Since this call will include references to non-GAAP results, ....
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