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Among the newly announced speakers include engineers, technical directors, CTOs, and R&D directors from Ayar Labs, Broadcom, Intel, KAIST, Microsoft Azure, NXP, and Xilinx. Semiconductor units have bucked the pandemic downturn and are expected to see a new record high in 2021 with a 13% lift in shipments. This growth creates its own unique challenges and opportunities for chip, board, and systems engineers as electronics require increasingly complex components; we are proud to share that this year s conference is strategically designed to facilitate peer-to-peer connection and address these timely issues, said Suzanne Deffree, group event director, DesignCon. The full DesignCon conference comprises 14 tracks, plus additional tracks dedicated to the Drive World and Embedded Systems Conference geared toward

Suzanne deffreeDensity semiconductor package technologySan jose mcenery convention centerSan joseSan jose mcenery conventionAyar labsMicrosoft azureDrive worldEmbedded systems conferenceWelcome receptionSilicon valleyLanguage model enables extremely fastRobust routingChiplet interconnectHigh bandwidth memoryResponse surface model