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Share this article Share this article TAICHUNG, Taiwan and MOUNTAIN VIEW, Calif., Jan. 26, 2021 /PRNewswire/  Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today revealed that its low-power, high-performance LPDDR4X DRAM technology is supporting the latest breakthrough in edge computing from Flex Logix ® for demanding Artificial Intelligence (AI) applications such as object recognition. (PRNewsfoto/Flex Logix Technologies, Inc.) (PRNewsfoto/Flex Logix Technologies, Inc.) The Winbond LPDDR4X chip is being paired with Flex Logix s InferX™ X1 edge inference accelerator chip, which is based on an innovative architecture that features arrays of reconfigurable Tensor Processors. This provides higher throughput and lower latency at lower cost than existing AI edge computing solutions when processing complex neural networking algorithms such as YOLOv3 or Full Accuracy Winograd.

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