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Senet and Murata Collaborate to Optimize IoT Solution Performance – Consumer Electronics Net

3 weeks ago Certification of Firmware Updates Over the Air Provides Device Lifecycle and Performance Advantages for Large Scale IoT Deployments PORTSMOUTH, N.H.–(BUSINESS WIRE)–#Cities Senet, Inc., a leading provider of cloud-based software and services platforms that enable global connectivity and on-demand network build-outs for the Internet of Things (IoT), today announced a collaboration with Murata to certify operation of the Firmware Updates Over-the-Air (FUOTA) capabilities of the Murata Type 1SJ LoRaWAN ® modem module with the Senet LoRaWAN network server. Through this integration, Senet has certified the secure and reliable remote multicast delivery of firmware images to end-devices developed with the Murata Type 1SJ LoRaWAN modem module to be compliant with the technical recommendations of the LoRa Alliance

Sony Provides NB-Optimized, Battery-saving 5G-Ready Chipset

Sony Provides NB-Optimized, Battery-saving 5G-Ready Chipset By Arti LoftusMarch 05, 2021 Narrowband Internet of Things (NB-IoT) is a Low Power Wide Area Network (LPWAN) radio technology that serves to enable a wide variety of cellular devices and services while operating on existing cellular networks. Developed to specialize in efficient communication, extended battery life, and decreased costs, NB-IoT offers intrinsic value for enhancing infrastructures with an industrial-grade LPWA solution.  A leading provider of cellular IoT chipsets, Israel-based Sony Semiconductor, has recently announced the addition of the ALT1255 chipset to their low-power cellular IoT solution portfolio that include ALT1160 for CAT-1 connectivity and ALT1250 for CAT-M, NB, and 2G connectivity. As an up-to-date low-power NB2 chipset, the ALT1255 builds upon its predecessors by incorporating an integrated SIM (iSIM), user MCU, rich application layer, and GSM/GPRS fallback modem.

Semtech and DTDS Accelerate IoT Development With New Module – Consumer Electronics Net

1 month ago The 622 Module is LoRaWAN® compliant and includes an embedded Renesas MCU for leading low power consumption CAMARILLO, Calif.–(BUSINESS WIRE)–Semtech Corporation (Nasdaq: SMTC), a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, and DTDS Technology (DTDS), a distribution company in the field of electronic components and design value-added services, have announced the development of a new module operating on the LoRaWAN® protocol. DTDS’s “622 Module” leverages an integrated Renesas MCU to offer enhanced network coverage and strength in automotive and industrial Internet of Things (IoT) applications. The module delivers long range connectivity and low operating power, simplifying the development process for IoT products without compromising performance.

Global LPWAN Market to Cross $80 Bn by 2027, Global Market Insights, Inc

Global LPWAN Market to Cross $80 Bn by 2027, Global Market Insights, Inc. SELBYVILLE, Del., Feb. 24, 2021 /PRNewswire/  Global Market Insights, Inc. has recently added a new report on the low power wide area network (LPWAN) market, which estimates the market valuation for LPWAN will cross US $80 billion by 2027. The growing popularity of dedicated M2M communication networks, such as NB-IoT and LTE-M, is expected to contribute significantly to the market growth. The growing demand for robust connectivity and consistent data transmission in a business or industrial environment is expected to support the LPWAN market demand. The LPWAN technology helps enterprises to provide large-scale wireless connectivity through a limited number of gateways. It significantly minimizes the capital and operational expenditures, enabling business efficiencies. LPWAN technologies provide long-range connectivity to IoT devices and reduce their power consumption. The growing demand for low-cost an

Global LPWAN Market to Cross $80 Bn by 2027, Global Market Insights, Inc

Global LPWAN Market to Cross $80 Bn by 2027, Global Market Insights, Inc
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