Integrated optical phased arrays to reduce the cost of LiDAR CEA-Leti has developed genetic algorithms to calibrate high-channel-count optical phased arrays (OPAs), as well as an advanced measurement setup enabling wafer-scale OPA characterization, that could reduce the cost and size of LiDAR systems.
OPAs are an emerging technology made of arrays of closely spaced (around 1µm) optical antennas and which radiate coherent light in a broad angular range. The produced interference pattern can then be changed by adjusting the relative phase of the light emitted by each antenna. If, for example, the phase gradient between the antennas is linear, a directional beam will be formed. By changing the slope of the linear gradient, the direction of the beam can be controlled, which enables solid-state beam steering.
Swiss technology enables cloud-based photonic quantum computer
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Some analysts consider Intel to be a processor company with manufacturing facilities – others consider it to be a manufacturing company that just happens to make processors. In the grand scheme of things, Intel is a hybrid of product, manufacturing, expertise, investment, and perhaps most importantly, research. Intel has a lot of research and development on its books, most of it aimed at current product cycles in the 12-36 month time span, but beyond that, as with most big engineering companies, there’s a team of people dedicated to finding the next big thing over 10-20+ years. This is usually called the Moonshot Division in most companies, but here we find it called Intel Labs, and leading this team of path-finding gurus is Dr. Richard Uhlig.
ORC and Pointcloud develop chip lidar to improve machine visionâ¦
17 Feb 2021
â¦while Teledyne Imaging launches LACera, CMOS-based imaging technology for discovery applications.
Accurate imaging is essential for machines to map and interact with the physical world but the size and costs of the technology currently needed has limited LIDARâs use in commercial applications.
Now a team of researchers from Pointcloud Inc., in San Francisco, CA, US, and the Optoelectronic Research Centre (ORC), at University of Southampton, UK, have developed a new, integrated system, which uses silicon photonic components and CMOS electronic circuits in the same microchip.
The prototype they have developed would be a low-cost solution and could pave the way to large volume production of low-cost, compact and high-performance 3D imaging cameras for use in robotics, autonomous navigation systems, mapping of building sites to increase safety and in healthcare.
Silicon Chip Provides Low Cost Solution to Help Machines See the World Clearly
Written by AZoOpticsFeb 10 2021
Researchers in Southampton and San Francisco have developed the first compact 3D LiDAR imaging system that can match and exceed the performance and accuracy of most advanced, mechanical systems currently used.
Basketball and screen at 17 m - picture taken using a 32 x 16 pixel sensor (2 mm x 2.5 mm sensor size). Image Credit: Pointcloud Inc.
3D LiDAR can provide accurate imaging and mapping for many applications; it is the eyes for self-driving cars and is used in facial recognition software and by autonomous robots and drones. Accurate imaging is essential for machines to map and interact with the physical world but the size and costs of the technology currently needed has limited LIDAR’s use in commercial applications.
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