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05/24/2021 | Press release | Distributed by Public on 05/24/2021 00:14 GUC Announces GLink-3D Die-on-Die Interface IP using TSMC N5 and N6 Process for 3DFabric™ Advanced Packaging Technology Hsinchu, Taiwan - May 24, 2021 - Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces GLink-3D die-on-die interface IP using TSMC s N5 and N6 processes and 3DFabric™advanced packaging technology for AI, HPC, and Networking applications. AI/HPC/Networking memory demand is growing quickly and the SRAM to Logic ratio is also increasing. Logic gains higher density and performance when scaled to N5/N3 process nodes but SRAM scaling from N7 to N5/N3 is moderate. SRAM/Logic disintegration allows the implementation of separate SRAM and Logic at the most efficient process nodes. Layers of CPU and SRAM (Last Level Cache, packet buffers) dies can be assembled over and under interconnect/IO dies using TSMC 3DFabric packaging technology. Such expandable SRAM and modular computing appli

United statesKen chenIgor elkanovichTaiwan stock exchangeNetwork processorsGlobal unichip corpLast level cacheGlobal unichip corp via public guc announces glink 3d die on interface ip using tsmc n5 and n6 process for 3dfabric advanced packaging technologyஒன்றுபட்டது மாநிலங்களில்கேன் சென்டைவாந் ஸ்டாக் பரிமாற்றம்வலைப்பின்னல் ப்ராஸெஸர்ஸ்கடந்த நிலை தற்காலிக சேமிப்பு