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Samsung memory module unveiled with Compute Express Link

Silex Insight extends their AES-GCM Crypto Engine offering by introducing an ultra-low latency version for PCI Express 5 0 and Compute Express Link 2 0

May 11, 2021 Silex Insight extends their AES-GCM Crypto Engine offering by introducing an ultra-low latency version for PCI Express 5.0 and Compute Express Link 2.0 Silex Insight, a leading provider for flexible security IP cores, announces today a complete family (3 variants) of their NIST-compliant AES-GCM crypto engines by adding an ultra-low latency version to their portfolio to serve high-performance computing (HPC) SoCs using the PCI Express ® (PCIe ™ (CXL ™) 2.0 interface. The AES-GCM ultra-low latency crypto engine is targeted for CXL link encryption with an implementation of the AES-GCM algorithm compliant with the NIST SP 800-38D standard. The unique architecture enables high throughput while maintaining an optimal resource usage.

Avery Design Debuts CXL™ 2 0 System-level VIP Simulation Solution

Avery Design Debuts CXL™ 2.0 System-level VIP Simulation Solution Tewksbury, MA., April 15, 2021  Avery Design Systems, a leader in functional verification solutions, today announced its CXL TM 2.0 system-level simulation solution. The comprehensive offering supports the co-simulation of a CXL-aware Linux kernel and QEMU x86 virtual host system emulator with its SystemVerilog CXL Host VIP. The solution enables pre-silicon hardware-software validation of CXL 2.0 Type 3 memory expansion system designs, accelerating development time and providing an efficient approach to customization and application development for systems using the CXL 2.0 interface standard “QEMU-CXL co-simulation creates the most complete and accurate representation of the CXL-enabled reference system environment from which to verify CXL 2.0 Type 3 SoC hardware RTL and software,” said Chris Browy, Vice President Sales and Marketing at Avery Design Systems. “Early integration of the actual hardware

Micron Abandoning 3D Xpoint in Favour for CXL

Micron Abandoning 3D Xpoint in Favour for CXL Recently, Micron announced that it is dropping the development of 3D Xpoint memory in favour of CXL. What is 3D Xpoint, what is CXL, and why is Micron changing tact? What is 3D Xpoint memory? 3D Xpoint memory is a non-volatile memory technology that was developed by Intel and Micron. The technology, unlike NAND FLASH, allows for individual bits to be accessed which can provide it enhanced performance over NAND (which has to have entire blocks erased before bits can be altered).  The memory technology utilises bulk resistance to store data, and while the exact material used between bit lines has not been publicly stated, what is known is that the technology utilises Chalcogenide glass. The bits are arranged so that each bit has two metal connectors (top and bottom), and a current is passed through one of the connectors. The resistance of the channel is measured, and this indicates the state of the bit.

Micron to put Utah computer chip factory up for sale as it shifts strategy

LEHI (Reuters) Micron Technology on Tuesday said it will put a chip factory in Lehi, Utah, up for sale as it quits making a type of memory chip it jointly developed with Intel nearly a decade ago. Lehi is Idaho-based Micron s only factory making what it calls 3D Xpoint memory, a form of memory chip that aimed to find a price-to-performance sweet spot between the two dominant forms of memory chip: DRAM, which is fast but pricey, and NAND, which is slower but cheaper. The factory will be sold in a transaction expected to close by the end of this year, company officials told Reuters.

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