Tử vi ngày 27/5/2021: Tuổi Tý gặp gỡ quý nhân, tuổi Mùi phát tài bất ngờ - Trắc nghiệm
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SHERMAN OAKS, CA / ACCESSWIRE / May 25, 2021 / Dear Ms. Chenoweth,
I, Leo Robin s grandson, sent you an open letter on March 2, 2021 via FedEx, nearly two months ago, but assume that you never received it since I haven t heard back from you. I am enclosing it once more so you will better understand the unprecedented circumstances surrounding the long-standing mistake made by the Hollywood Walk of Fame more than 30 years ago. The 1990 Walk of Fame Committee awarded a star to lyricist Leo Robin but the Hollywood Chamber of Commerce never installed it. The Hollywood Chamber as well as the Walk of Fame Committee continue to be morally adrift in regard to this unprecedented situation with the star awarded to Robin but not installed. And they must recognize that they bear responsibility for this on-going moral injustice and take the steps to address it.
GUC announces GLink-3D Die-on-Die interface IP Global Unichip (GUC), an ASIC developer, has announced GLink-3D die-on-die interface IP using TSMC s N5 and N6 processes and 3DFabric advanced packaging technology for AI, HPC, and networking applications.
With AI, HPC and networking memory demand growing there is a need for SRAM/Logic disintegration allowing the implementation of separate SRAM and Logic at the most efficient process nodes.
Layers of CPU and SRAM (Last Level Cache, packet buffers) dies can be assembled over and under interconnect/IO dies using TSMC s 3DFabric packaging technology and these expandable SRAM and modular computing applications can be enabled by GUC GLink-3D high bandwidth, low latency, low power, and point-to-multipoint interface between 3D stacked dies.
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