IDEX Biometrics Further Strengthens its Supply Chain by Partnering with MFLEX
IDEX Biometrics ASA, a leading provider of advanced fingerprint identification and authentication solutions, has signed an agreement with Multi-Fineline Electronix, Inc. (MFLEX), a subsidiary of Suzhou Dongshan Precision Manufacturing Co., Ltd. (DSBJ), and a leading global provider of high-quality, technologically advanced flexible printed circuits and assemblies. The agreement forms a key part of IDEX’s mass production ready supply chain, essential to meet the growing demand for biometric payment cards.
Under the agreement, MFLEX will provide flexible printed circuit assemblies for IDEX’s biometric payment card reference design. This reference design is the only biometric smart card reference design that has been used in cards certified by China UnionPay. MFLEX has received an initial order from a Tier 1 card manufacturer.
Calumet Electronics Becomes America’s Only HUBZone Certified PCB Supplier
Calumet Electronics is pleased to announce its SBA certification as a HUBZone business. The certification enables the company to meet the demands of the U.S. Department of Defense (DoD) while maintaining its commitment to the local community and protecting American security interests as a leading electronics manufacturer.
Calumet now fills a vital need for DoD companies that are required to use HUBZone certified businesses. Companies in the DoD supply chain can leverage Calumet s advanced and highly reliable circuit boards while meeting the federal government s HUBZone requirements. The certification also allows DoD companies to continue supporting critical jobs that Calumet brings to its small rural community in the Upper Peninsula of Michigan.
Footprints: A Distributor s Perspective iconnect007.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from iconnect007.com Daily Mail and Mail on Sunday newspapers.
TTM’s Approach to Stackup Design: Train the Customer
In this interview with the I-Connect007 Editorial Team, TTM’s Julie Ellis and Richard Dang drill down into stackup design, detailing some of the common stackup challenges that their customers face when designing for both prototype and volume levels, and offering advice to designers or engineers who are struggling with stackup issues. They also discuss why having too many different prepregs in a stackup can be asking for trouble, and how proper stackup design can optimize both the fabrication and assembly processes.
Andy Shaughnessy: Julie, why don’t you start by explaining why proper stackup design is so critical.
Pete Starkey Discusses His Favorite Career Moment iconnect007.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from iconnect007.com Daily Mail and Mail on Sunday newspapers.