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Blue Cheetah Demonstrates Industry Leading Silicon-Proven Die-to-Die Interconnect Solution for Chiplets

/PRNewswire/ Blue Cheetah Analog Design, the leader in rapidly customized die-to-die (D2D) interconnect IP solutions for chiplets, announced its latest.

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Alphawave Semi Showcases 3nm Connectivity Solutions and Chiplet-Enabled Platforms for High Performance Data Center Applications

Alphawave Semi Showcases 3nm Connectivity Solutions and Chiplet-Enabled Platforms for High Performance Data Center Applications
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Fraunhofer Selects Achronix eFPGAs to Build Heterogeneous Chiplet Demonstrator

Fraunhofer Selects Achronix eFPGAs to Build Heterogeneous Chiplet Demonstrator
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Fraunhofer IIS/EAS Selects Achronix Embedded FPGAs (eFPGAs) to Build Heterogeneous Chiplet Demonstrator for HPC - High-Performance Computing News Analysis

Santa Clara, Calif., and Dresden, Germany, April 25, 2023 – Fraunhofer IIS/EAS, an applied research institute in advanced package solution design, and [.]

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Fraunhofer IIS/EAS Selects Achronix Embedded FPGAs (eFPGAs) to Build Heterogeneous Chiplet Demonstrator

Santa Clara, Calif., and Dresden, Germany, April 25, 2023 – In a continuing commitment to enabling industry-leading solutions for the semiconductor market, Fraunhofer IIS/EAS, leading-edge applied research institute in the field of advanced package solution design, and Achronix Semiconductor Corporation, the industry’s only independent supplier of high-end FPGAs and eFPGA IP solutions, are entering today in a…

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