SK hynix confirms advanced packaging facility for next-gen HBM, collaborating with Purdue University for R&D, with $3.87 billion facility in Indiana, USA.
President Mung Chiang announced at the Purdue Memorial Union North Ballroom Wednesday afternoon that Purdue was not only on the forefront of advancements in AI, but that Indiana would soon
WEST LAFAYETTE, Ind. (WLFI) - With plans to build a chip packaging facility near Purdue s campus, SK Hynix s leaders are calling West Lafayette a "hub for scientific development."
SK Hynix Announces Semiconductor Advanced Packaging Investment in Purdue Research Park koreabizwire.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from koreabizwire.com Daily Mail and Mail on Sunday newspapers.