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Taiwan-based OSATs see upstream orders increase in 2Q23

Taiwan-based OSATs such as ChipMOS Technologies and Chipbond Technology are seeing the monthly operating growth rate of chip and backend companies exceed 20%.

Taiwan
Chipmos-technologies
Chipbond-technology
Chipbond
Chipmos
Hips-components
Odi
Display-components
Isplay-driver-ic
Isplays-photonics
C-design

Taiwan OSATs quietly ramp up support for Chinese customers

Taiwan-based OSATs such as King Yuan Electronics (KYEC) and ASE Group, have quietly ramped up their capacity support for China-based clients including Huawei s HiSilicon, Oppo s Zeku, and Unisoc.

China
Zeku
Shandong
King-yuan
Guangxi
Huawei
King-yuan-electronics
Chunghwa-precision-test-tech
Winway-tech
Zeku-technologies
Case-group

Semiconductor advanced packaging market Size to increase by USD 21,157.5 million: 33% growth to originate from APAC

/PRNewswire/ The Semiconductor Advanced Packaging Market by Type, Technology, and Geography - Forecast and Analysis 2023-2027 report has been published by.

Germany
Taiwan
Japan
United-states
India
United-kingdom
King-yuan
Guangxi
China
Canada
America
Jesse-maida

Semiconductor advanced packaging market Size to increase by USD 21,157.5 million: 33% growth to originate from APAC

/PRNewswire/ The Semiconductor Advanced Packaging Market by Type, Technology, and Geography - Forecast and Analysis 2023-2027 report has been published by.

Germany
Taiwan
Japan
United-states
India
United-kingdom
King-yuan
Guangxi
China
Canada
America
Jesse-maida

Valued to be $50.6 Billion by 2026, Semiconductor Advanced Packaging Slated for Robust Growth Worldwide

/PRNewswire/ A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled.

Germany
Australia
Japan
United-states
India
United-kingdom
China
Italy
Canada
Tongfu
Jiangxi
South-korea

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