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Semiconductor packaging integration center opened

Industrial and government partners announced the creation of the Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES).

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Penn State leads semiconductor packaging, heterogeneous integration center

The Semiconductor Research Corporation’s Joint University Microelectronics Program 2.0, a consortium of industrial partners in cooperation with the Defense Advanced Research Projects Agency, has announced the creation of a $32.7 million, Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems.

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