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Week In Review: Manufacturing, Test UMC expands; Ford’s chip woes; ASE ups CapEx; phone shakeup. Chipmakers and OEMs Several foundry vendors are expanding their fab capacity. The latest is UMC, which announced plans to expand capacity at its 300mm Fab 12A Phase 6 (P6) in Taiwan’s Tainan Science Park. UMC has operated in the Tainan Science Park since 1999, when Fab 12A was established as Taiwan’s first 300mm fab. Fab 12A is currently operating at a capacity of approximately 90,000 300mm wafers per month (wpm), with an additional 10,000 wpm being installed at P5 starting in 2021. The P6 project will add 27,500 more wpm production capability when fully equipped. P6 will be equipped with fab tools, enabling 28nm processes with the flexibility to produce smaller nodes down to 14nm. The P6 expansion is scheduled for production in the second quarter of 2023, with total investment for the project earmarked at NT$100 billion (US$3.6 billion). In addition to UMC’s previously ann

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