Highlights: ● The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning, implementation and system analysis to optimize PPA for multi-chiplet systems ● The Tempus Timing Signoff Solution with inter-die analysis and STA technologies results in faster time to tapeout ● The Voltus IC Power Integrity Solution, tightly coupled with the…
Cadence Integrity 3D-IC Platform Supports Advanced Multi-Chiplet Designs iconnect007.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from iconnect007.com Daily Mail and Mail on Sunday newspapers.
Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs – Consumer Electronics Net consumerelectronicsnet.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from consumerelectronicsnet.com Daily Mail and Mail on Sunday newspapers.
Accelerating system innovation with breakthrough 3D-IC platform electropages.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from electropages.com Daily Mail and Mail on Sunday newspapers.
Highlights: • Integrity 3D-IC integrates design planning, implementation and system analysis in a single, unified cockpit • Designers can achieve system-driven PPA through the availability of integrated thermal, power and static timing analysis capabilities • Cadence’s third-generation 3D-IC solution supports a wide range of application areas including, hyperscale computing, consumer, 5G communications, mobile and automotive…