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Ampere-based 80-core server-type module

ADLINK   has introduced the COM-HPC Ampere Altra,  an 80-core COM-HPC server-type module. The module targets edge platforms that process compute intensive

ADLINK launches COM-HPC server modules with 80-core Ampere® Altra® Arm-based SoCs for embedded applications

ADLINK launches COM-HPC server modules with 80-core Ampere® Altra® Arm-based SoCs for embedded applications
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ADLINK Launches COM-HPC Server Modules with 80-Core Ampere Altra Arm-based SoCs for Embedded Applications

ADLINK Launches COM-HPC Server Modules with 80-Core Ampere Altra Arm-based SoCs for Embedded Applications
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Cadence collaboration with Arm enables tape-out of next-generation mobile designs

Cadence collaboration with Arm enables tape-out of next-generation mobile designs Cadence Design Systems has announced that a collaboration with Arm has enabled customers to successfully tape-out next-generation Arm mobile designs. According to Cadence, customers have successfully taped out mobile SoCs using its tools for the next-generation Arm mobile solution, which includes the Arm Cortex-X2, Cortex-A710, and Cortex-A510 CPUs, Mali-G710 GPU and the DynamIQ Shared Unit-110. As part of the collaboration, Cadence has fine-tuned its digital and verification full flows on 5nm and 7nm process technologies to drive adoption of the new Arm mobile solution on the Armv9 architecture. In addition, Cadence delivered 5nm and 7nm RTL-to-GDS digital flow Rapid Adoption Kits (RAKs) to enable customers to achieve optimal power, performance and area (PPA) and accelerate time to tape-out.

Cadence Collaboration With Arm Enables Customers to Successfully Tape out Next-Generation Arm Mobile Designs

Cadence Collaboration With Arm Enables Customers to Successfully Tape out Next-Generation Arm Mobile Designs
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