comparemela.com
Home
Live Updates
TSMC lays out roadmap for massive, kilowatt-class chip packages and terabit optical links : comparemela.com
TSMC lays out roadmap for massive, kilowatt-class chip packages and terabit optical links
Starting with the chip packaging tech, which TSMC has branded "CoWoS" (Chip-on-Wafer-on-Substrate), it's essentially an enhanced version of typical chiplet designs, where multiple smaller dies are integrated...
Related Keywords
United States ,
American ,
,
Nvidia ,
Broadcom ,
North American ,
Compact Universal Photonic Engine ,
comparemela.com © 2020. All Rights Reserved.