comparemela.com
Home
Live Updates
Three-Dimensional Bonding of Energy Efficient Electronic Devices : comparemela.com
Three-Dimensional Bonding of Energy Efficient Electronic Devices
At Osaka University, a new technique has been illustrated by the scientists for making three-dimensional integrated circuit connections that function at low temperatures and does not need external pressure.
Related Keywords
Osaka ,
Japan ,
Zheng Zhang ,
Osaka University ,
Integration Laboratory At Osaka University ,
Dimensional Bonding Of Energy Efficient Electronic Devices ,
Direct Three Dimensional Bonding ,
Energy Efficient Electronic ,
System Integration Laboratory ,
Study First Author ,
comparemela.com © 2020. All Rights Reserved.