3D IC and 2.5D IC Packaging Market worth $82.0 billion by 2028 - Exclusive Report by MarketsandMarkets

CHICAGO, May 2, 2023 /PRNewswire/ -- The 3D IC and 2.5D IC packaging market is expected to reach USD 82.0 billion by 2028 from USD 49.3 billion in 2023, at a CAGR of 10.7% during the 2023-2028

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